Description
The 2UUL BH11 IC Reballing Pad is designed for mobile repairing professionals who need stability and precision while working on smartphone motherboards. This magnetic reballing platform helps hold compatible reballing stencils securely during IC and CPU reballing operations.
Its dual-depth groove design provides 1 mm and 2 mm positioning options for different motherboard and chip thicknesses. The heat-resistant construction is suitable for hot-air rework when used according to the manufacturer’s guidelines.
2UUL BH11 IC Reballing Pad Key Features
- Strong Magnetic Base: Helps hold compatible metal reballing stencils in position.
- Dual-Depth Groove Design: Features 1 mm and 2 mm grooves for different repair applications.
- Heat-Resistant Construction: Designed for use during suitable hot-air rework operations.
- Precision Reballing: Helps maintain stencil alignment for more accurate tin planting.
- Stable Working Platform: Supports IC and motherboard positioning during repair.
- Professional Repair Tool: Suitable for mobile phone technicians and electronics repair professionals.
Applications
- IC and CPU reballing
- BGA chip repair
- Mobile motherboard repair
- iPhone and Android board repair
- NAND and other compatible chip reballing
- Precision soldering and tin planting
Package Contents
- 1 × 2UUL BH11 Magnetic Reballing Frame
- 2 × Tin Scrapers / Blades
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