Description
The 2UUL BH15 IC Reballing Mat is a practical tool for mobile repairing technicians who perform IC reballing, CPU repair, and precision soldering. Made from soft silicone material, this compact pad provides a stable surface for handling small electronic chips and working with reballing stencils.
2UUL BH15 IC Reballing Mat Key Features
- Magnetic Holding: Helps keep compatible metal reballing stencils in position during IC reballing.
- Heat-Resistant Silicone: Designed for use in soldering and hot-air rework environments.
- Anti-Slip Surface: Helps prevent small chips and components from shifting during repair work.
- Easy to Clean: Silicone surface makes it convenient to clean soldering residue and flux after use.
- Compact Design: Suitable for mobile repairing workbenches and electronics repair toolkits.
- Multiple Applications: Useful for BGA reballing, CPU and IC repair, NAND chip work, and precision soldering.
Applications
- Mobile phone IC reballing
- CPU and BGA chip repair
- NAND chip repair
- IC soldering and replacement
- Precision electronics repair
Package Contents
- 1 × 2UUL BH15 MagGrid Silicone Reballing Pad
Note: Use suitable reballing stencils and follow the recommended temperature limits for your specific product. Confirm the exact specifications and package contents before purchase.
| Specification | Details |
|---|---|
| Brand | 2UUL |
| Model | BH15 |
| Product Type | Magnetic IC Reballing Mat |
| Product Name | MagGrid Pad |
| Material | Silicone |
| Features | Magnetic, heat-resistant, anti-slip |
| Applications | IC, CPU, BGA repair |
| Colour | Green |
| Package Contents | 1 × Reballing Pad |


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